PCB Manufacturing Capability
|
PCB specification |
Length x Width | Minimum | 50 x 30mm | L<50mm or W<30mm |
| Maximum | 510 x 460mm | 800>L>510mm | ||
| Thickness | Minimum | 0.2mm | ||
| Maximum | 5mm | T>5mm | ||
| PCB specification of DIP operation |
Length x Width | Minimum | 50 x 30mm | L<50mm |
| Maximum | 510 x 460mm | 1000>L>510mm | ||
| Thickness | Minimum | 0.4mm | ||
| Maximum | 5mm | T>5mm | ||
| Specification of SMT component | Outline size | Min. specifications | 0603(0201) | 0602(01005) |
| Max. size | 45 x 45mm | 68x68mm(45x150mm) | ||
| Thickness of component | 25.4mm | T>25.4mm | ||
| QFP/SOP/SOJ/IC Socket etc. | Min. distance of PIN | Pitch=0.4mm | Pitch=0.3mm | |
| CSP, BGA | Min. distance of BGA ball | Pitch=0.5mm | Pitch=0.3mm |
