HDI PCB

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HDI PCB Board

Layers: 12
Thickness: 2.0 + / – 0.15 mm
Plate used: FR4 SY
Minimum aperture: 0.1mm
Surface treatment: ENIG
BGA size: 0.25mm
Minimum line width/distance: 0.13mm/0.15mm
Blind hole structure: 1-2,2-3,3-4,9-10,10-11, 11-12
BGA size: 0.25mm
Minimum line width/distance: 0.13mm/0.15mm
Blind hole structure: 1-2,2-3,3-4,9-10,10-11, 11-12

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Multilayer HDI PCB

Material: FR4 high TG

Base copper foil thickness: outer 1oz;The inner 1/3 oz Minimum line width/distance: 2mil/2mil

Minimum hole diameter: 0.2mm   

Minimum hole diameter of laser drilling: 0.075mm

Blind hole depth ratio: 1:1      

Maximum finished size: 500mm X600mm

Surface treatment: OSP + chemical Immersion gold      

Welding resistance color: green

Special technology: blind buried hole

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