Layers: 12
Thickness: 2.0 + / – 0.15 mm
Plate used: FR4 SY
Minimum aperture: 0.1mm
Surface treatment: ENIG
BGA size: 0.25mm
Minimum line width/distance: 0.13mm/0.15mm
Blind hole structure: 1-2,2-3,3-4,9-10,10-11, 11-12
BGA size: 0.25mm
Minimum line width/distance: 0.13mm/0.15mm
Blind hole structure: 1-2,2-3,3-4,9-10,10-11, 11-12
Material: FR4 high TG
Base copper foil thickness: outer 1oz;The inner 1/3 oz Minimum line width/distance: 2mil/2mil
Minimum hole diameter: 0.2mm
Minimum hole diameter of laser drilling: 0.075mm
Blind hole depth ratio: 1:1
Maximum finished size: 500mm X600mm
Surface treatment: OSP + chemical Immersion gold
Welding resistance color: green
Special technology: blind buried hole