Layers: 12
Thickness: 2.0 + / – 0.15 mm
Plate used: FR4 SY
Minimum aperture: 0.1mm
Surface treatment: ENIG
BGA size: 0.25mm
Minimum line width/distance: 0.13mm/0.15mm
Blind hole structure: 1-2,2-3,3-4,9-10,10-11, 11-12
BGA size: 0.25mm
Minimum line width/distance: 0.13mm/0.15mm
Blind hole structure: 1-2,2-3,3-4,9-10,10-11, 11-12
PCB Layers: 1 to 18layers
PCB Max working panel area: 800mmx 508mm
Min board thickness: 4 layer: 0.40mm ;6 layer: 0.80mm ; 8 layer: 1.00mm ;10 layer: 1.20mm
Min trace width: 0.1mm Min spacing: 0.1mm
Min hole diameter: 0.2mm
Min Copper thickness in hole: 0.02mm
PTH size tolerance : ±2mil
NPTH size tolerance: ±1mil
Hole position tolerance : ±0.05mm
Registration of inner layer: ±3mil(75um)
Min drilling diameter: 0.15mm
Min diameter of finished hole: 0.1mm
Layers: 1–22
Copper thickness: 1–6OZ
Base material: FR4
Finished surface：Conventional hasl, Lead free hasl, Immersion gold, Immersion tin,Immersion silver, Hard gold, OSP.
Finished board thickness: 0.2-7.0mm
Board thickness tolerance:
Board thickness≤1.0mm: +/-0.1mm
Board thickness≤2.0mm: +/-10%
Board thickness>2.0mm: +/-8%
Layer Counts: 1–10L
Min. Line Width: 0.05mm
Min. Hole Size: 0.15mm PTH
Min. PTH Hole Ring: 0.45mm
Min. Gap between Cover Layer and Pad: 0.1mm
Min. Gap between Trace and Outline: 0.2mm
Trace Width Tolerance: +/-0.05mm L≤ 25mm
Hole Size Tolerance: +/-0.05mm
Stiffener and Outline Tolerance : +/-0.25mm
Surface Treatment: ENIG, Gold Plating, HAL, Plating Pb-Sn
Layers: 2-30 layers
Board Material: FR4
Copper Thickness: 1oz
Board Thickness: 1.6mm
Min. Hole Size: 0.15mm
Min. Line Width: 0.1mm
Min. Line Spacing: 0.1mm
Solder Mask type: Green/Blue/Yellow/Red etc
Board Thickness Tolerance: ±10%
PCB Test: 100% Testing
PCB Layers: 1 to 30 Layers
Base Material: FR-4
Min trace width: 0.1mm
Min Spacing: 0.1mm
Min Copper thickness in hole: 0.2mm
Pcb thickness coverage: 0.2 to 6.0mm
Min copper thickness in hole: 0.02mm
Solder mask type: Blue,Green,Black,Yellow,Red,White…
Surface finish: ENIG, Gold plating, Immersion silver, Immersion tin etc.
Quote Requirements for PCB & PCB Assembly project:Gerber File and Bom List.
Product Parameter:
Service: PCB and SMT assembly with one-stop service
Material: FR4, high frequency, alum, FPC
Number of layers: 1-30 Layers
Board thickness: 1.6mm
Copper Thickness: 1oz
Solder Mask: Green,white,black,red,blue…
Surface Finishing : HASL lead free
Function Test: 100% Functional test
PCBA Testing: X-ray, AOI Test, Functional test
Delivery time: PCB: 3-8days PCBA: 10-20days
Material: FR4 high TG
Base copper foil thickness: outer 1oz;The inner 1/3 oz Minimum line width/distance: 2mil/2mil
Minimum hole diameter: 0.2mm
Minimum hole diameter of laser drilling: 0.075mm
Blind hole depth ratio: 1:1
Maximum finished size: 500mm X600mm
Surface treatment: OSP + chemical Immersion gold
Welding resistance color: green
Special technology: blind buried hole
Layers : 2-30 layers printed circuit board
Board Material: FR4
Copper Thickness: 1oz
Board Thickness: 1.6mm
Min. Hole Size: 0.15mm
Min. Line Width: 0.1mm
Min. Line Spacing: 0.1mm
Solder Mask type: Green/Blue/Yellow/Red etc…
Board Thickness Tolerance: ±10%
PCB Test: 100% Testing
Layers: 2-30 layers printed circuit board
Board Material: FR4
Copper Thickness: 1oz
Board Thickness: 1.6mm
Min. Hole Size: 0.15mm
Min. Line Width: 0.1mm
Min. Line Spacing: 0.1mm
Solder Mask type: Green/Blue/Yellow/Red
Board Thickness Tolerance: ±10%
PCB Test: 100% Testing
Materials： FR-4/CEM-1/CEM-3/Aluminum
Layer：customized
Board Thickness：0.2mm-0.4mm
Board Thickness Tolerance：+/-10%
Copper Thickness：17.5um-175um(0.5oz-5oz)
Min Trace Width：0.15mm
Min Space Width：0.15mm
Min Drilling Dia：0.2mm
Number of Layers：1-36layer
Base Material:FR-4
Copper Thickness: 1oz
Board Thickness:1.6mm
Min. Hole Size:4mil
Min. Line Width:4mil
Min. Line Spacing:4mil
Layer： 1-36 layers
Base Material： FR4
Solder mask color：Customized
Surface Finishing：Lead-Free HASL/ENIG/Gold Finger/OSP
Finish：copper thickness 1.5 OZ
Board THK：1.6MM
Min. Line Width/Space：3/3mil
Base Material: Aluminum
Copper Thickness: 1oz
Board Thickness: 1.6mm
Min. Hole Size: 0.3mm
Min. Line Width: 0.075mm
Min. Line Spacing: 0.075mm
Surface Finishing: LF HASL
Standard: IPC-A-610G
Tolerance of finished panel thickness: ±10%
Layer： 1-24 layers
Base Material： FR4
Solder mask color：Customized
Surface Finishing： Lead-Free HASL/ENIG/Gold Finger/OSP
Finish copper thickness： 1.5OZ
Finished Board THK：1.6MM
Min. Line Width/Space：3/3mil
Base Material:FR4
Copper Thickness:1OZ
Board Thickness: 3.5+/-0.3mm
Min. Hole Size:0.2mm
Min. Line Width:0.1mm
Min. Line Spacing:0.1mm
Tolerance of Impedance Control: 5%
PCB standard:IPC-A-610 D