Layer: 1-30 layer
Material: FR-4,CEM-1,CEM-3,Hight TG,Aluminum
Board thickness: 0.2mm-7mm
Min.line width: 0.075mm(3mil)
Min.line spacing: 0.075mm(3mil)
Hole tolerance: PTH:±0.076,NTPH:±0.05
Copper thickness: 0.5-4.0oz
Surface treatment: HASL\OSP\ENIG\ENIS
Layers: 2-30 layers printed circuit board
Board Material : FR4
Copper Thickness: 1oz
Board Thickness : 1.6mm
Min. Hole Size: 0.15mm
Min. Line Width: 0.1mm
Min. Line Spacing: 0.1mm
Surface Finishing : HASL /lead free
Solder Mask type : Green/Blue/Yellow/Red/Customized
Board Thickness Tolerance: ±10%
Vehicle Mounted Millimeter Wave Radar PCB Assembly
Materials FR-4/CEM-1/CEM-3/Aluminum
Layer: Customized
Board Thickness : 0.2mm-0.4mm
Board Thickness : Tolerance +/-10%
Copper Thickness : 17.5um-175um(0.5oz-5oz)
Min Trace Width : 0.15mm
Min Space Width : 0.15mm
Min Drilling Dia : 0.2mm
Soldermask : Green,red,blue,white,black,yellow,etc.
Suface Finish : Plating HASL/Lead Free HASL/OSP/Gold Plating/Immersion Gold/ENIG
Power Adapter PCB Assembly
Layer count: 1-18 layers
Material : fr4,Tg=135,150,170,180,210,cem-3,cem-1,al base,rogers,nelco
Copper thickness : 1/2oz,1oz,2oz,3oz,4oz,5oz
Board thickness : 8-236mil(0.2-6.0mm)
Min.line : width/space 3/3 mil(75/75um)
Min. drill size : 8 mil(0.2mm)
Min. HDI laser drill size : 3 mil(0.067mm)
Tolerance of hole size : 2 mil(0.05mm)
PTH copper thickness : 1 mil(25 um)
Medical Equipement PCB Assembly
Layers : 1-30 layers printed circuit board
Board Material : FR4
Copper Thickness : 1oz
Board Thickness : 1.6mm
Min. Hole Size : 0.15mm
Min. Line Width : 0.1mm
Min. Line Spacing : 0.1mm
Solder Mask type : Green/Blue/Yellow/Red/ Customized
Design type: high speed, analog, digital and analog mixing, high density, high pressure, high power, rf, back plate, ATE, soft plate, hard plate, aluminum substrate, etc.
Mainstream Layout design tools: Allegro, pads, Mentor Expedition.
Main schematic tool support: CIS/ORCAD, concept-hdl, Montor DxDesigner, Design Capture, etc.
● High-speed PCB design
● 40G / 100G system design
● digital and analog hybrid PCB design
● SI/PI EMC simulation design
Layers: 2-30 layers printed circuit board
Board Material: FR4 Copper
Thickness: 1oz
Board Thickness: 1.6mm
Min. Hole Size: 0.15mm
Min. Line Width: 0.1mm
Min. Line Spacing: 0.1mm
Board Thickness Tolerance: ±10%
Material: FR4, high frequency, alum, FPC
Number of layers: 1-30 Layers
Board thickness: 1.6mm
Copper Thickness: 1oz
Soldermask : Green,red,blue,white,black,yellow,customized
Surface treatment: HASL\OSP\ENIG\ENIS
Application : Access Control System PCB Assembly
Type ：Rigid
Material：FR4, CEM1, CEM3, High Frequency Board,
Layer: 1-6L
Board Thickness: 0.2-4mm, regular 1.6mm
Copper Thickness: 0.5-4oz, regular 1oz
Silk Screen Min Line Width: 0.006″ or 0.15mm
Min Trace/Gap: 0.1mm or 4mils
Min Drill Hole Diameter: 0.01″,0.25mm or 10mils
Board type: communication board
Pin number: 4687
Layers: 8L
Maximum signal rate: 133MHz SDRAM and 50MHz clock line, 422 bus, 1553 bus
Pin number: 9298
Layers: 16L
Maximum signal rate: 2.5Gb/
Board type: NVDIMM strip
Pin number: 4498
Layers: 12L
Maximum signal rate: DDR4-2666
Layer： 1-24 layers
Base Material： FR4
Surface Finishing： Lead-Free HASL/ENIG/Gold Finger/OSP
Finish copper thickness： 1.5OZ
Finished Board THK： 1.6MM
Min. Line Width/Space： 3/3mil
Medical Equipement PCB Assembly
Layers : 1-30 layers printed circuit board
Board Material : FR4
Copper Thickness : 1oz
Board Thickness : 1.6mm
Min. Hole Size : 0.15mm
Min. Line Width : 0.1mm
Min. Line Spacing : 0.1mm
Solder Mask type : Green/Blue/Yellow/Red/ Customized
Layers: 12
Thickness: 2.0 + / – 0.15 mm
Plate used: FR4 SY
Minimum aperture: 0.1mm
Surface treatment: ENIG
BGA size: 0.25mm
Minimum line width/distance: 0.13mm/0.15mm
Blind hole structure: 1-2,2-3,3-4,9-10,10-11, 11-12
BGA size: 0.25mm
Minimum line width/distance: 0.13mm/0.15mm
Blind hole structure: 1-2,2-3,3-4,9-10,10-11, 11-12
PCB Layers: 1 to 18layers
PCB Max working panel area: 800mmx 508mm
Min board thickness: 4 layer: 0.40mm ;6 layer: 0.80mm ; 8 layer: 1.00mm ;10 layer: 1.20mm
Min trace width: 0.1mm Min spacing: 0.1mm
Min hole diameter: 0.2mm
Min Copper thickness in hole: 0.02mm
PTH size tolerance : ±2mil
NPTH size tolerance: ±1mil
Hole position tolerance : ±0.05mm
Registration of inner layer: ±3mil(75um)
Min drilling diameter: 0.15mm
Min diameter of finished hole: 0.1mm