PCB Design & Layout Capability |
||
| Min. line width | 0.05mm | trace spacing 0.05mm |
| Min.Vias | 0.15mm/0.1mm（激光） | Max.layer 48L |
| Min.BGA spacing | 0.35mm Max.BGA | Pin 3600pin |
| Max.high-speed signal | 40 GBPS | Fastest delivery time 12 Hours/ Item |
| Highest layer | 48L | HDI Highest layer 14 L any layer HDI |
